The global Fully Automatic Semiconductor Molding System market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, growing at a CAGR of % during the forecast period. The ...

Predominantly, if the metal part used in compression molding is tension or compression loaded, a ratio of metal part thickness to its extensional modulus, multiplied by the Bulk Molding Compound (BMC) ...

Dow (NYSE: Dow) will preview its latest silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021 in Booth #I2616. These next-generation silicone-organic hybrid adhesives, ...

Piper Plastics (Chandler, AZ) reports that it has developed a proprietary high-pressure molding technology that yields near-net-shape polymers up to 2 inches thick without porosity, voids or sinks.

The ongoing application of 5G as the standard network for communication devices will have a greater impact than just being able to upload photos to social media faster. The improved connections and ...